Solder Connection
Solder Connection
Solder connection tool used to create connection between solder, package and PCB bodies which is needed to compute the solder life.
Solder Fatigue is supported for OptiStruct Linear and Non Linear Static solutions without load case.
Description
Connection Type
Select the type of connection between the PCB and package bodies. Supports below
connection types.
- BGA (Ball Grid Array)
- Leadless Joint
Solder Connection for Difference in CTE method
- C4GAMMA Value - An emperical adjustment coefficient (C) depending on dwell time and maximum temperature. For the leadless joint type, value is 1/Sqrt(2).
Solder Connection for Darv creep energy density method
- Joint diameter - it is used as a final crack length of solder joint.
- K1,K2 - Constants in crack initiation equation.
- K3,K4 - Constants in crack growth equation.
Cards supported for various solvers
| Solver | Supported Cards |
|---|---|
| OptiStruct | FATSDR,PFATSDR |