Silk on Pad

Check if silkscreen data are overlapped with pads.

  • Silkscreen Definition: Define silkscreen layers for top and bottom layer.
    • Top: Select silkscreen top layer from layer list.
    • Bottom: Select silkscreen bottom layer from layer list.
    • Using Gerber Layers: If users want to use silkscreen as GERBER file in checking, define silkscreen GERBER top and bottom layer, respectively.
      • Top Silk Layer: Select silkscreen GERBER top layer.
      • Bottom Silk Layer: Select silkscreen GERBER bottom layer.
  • Target Component Definition: Define target components.
    • All Components: All components on board will be target components.
      • Exclude Components: Among whole components on board, select void-checking components by selecting component groups.
    • Component Group Selection: Select target components by selecting component groups.
  • Target Silkscreen Objects Definition


    Figure 1.
    • Pads Objects: Checks pads overlapping with silkscreen data in below list.
      • Component Text: Check pads overlapping with component text silkscreen.
      • Board Text: Check pads overlapping with board text silkscreen.
      • Component Figure: Check pads overlapping with component figure silkscreen.
      • Board Figure: Check pads overlapping with board figure silkscreen.
    • Vias Objects: Checks vias overlapping with silkscreen data in below list.
      • Component Text: Check vias overlapping with component text silkscreen.
      • Board Text: Check vias overlapping with board text silkscreen.
      • Component Figure: Check vias overlapping with component figure silkscreen.
      • Board Figure: Check vias overlapping with board figure silkscreen.
  • Checking
    • Clearance between Silkscreen and Target Objects: Check the clearance between silkscreen and selected objects. To do checking for this, set the clearance value.
      • Measure Base for Pads: Select measure base for pads.
        • PAD: Measure based on the Pad shape.
        • Solder Mask: Measure based on the Solder Mask shape.
        • Pad/Solder Mask Overlap: Measure based on the area where the Pad and the Solder Mask of component overlap.
    • Measure Base for Vias: Select measure base for Vias.
      • PAD: Measure based on the Pad shape.
      • Solder Mask: Measure based on the Solder Mask shape.
      • Pad/Solder Mask Overlap: Measure based on the area where the Via’s pad and the shape of the Solder Mask overlap.
    • Finding Via Cutouts for Polygon Type Silkscreen: If the silkscreen is composed with polygon, there should not be inner void polygon. PollEx DFM detects it.


      Figure 2.