Dummy Pad

Check existence of dummy pads.

Small pin-pitch SMD components use dummy pads to prevent solder-short. Commonly they placed at the opposite direction against soldering direction.
  • Target Layer Definition: Define target checking layer.
    • Top/Bottom: Select target layer between top and bottom.
  • Target Component Definition: Define target components.
    • Maximum Pin Pitch of Target Components: Set the maximum pin pitch value of components.
  • Dummy Pad Definition: Define dummy pad’s properties.
    • Solder Mask Area (Minimum MS Value): Set the minimum x(y) axis size of solder mask. It means dummy pads should have solder mask.
    • Dummy Pad Component Selection: If dummy pads are registered with component, select dummy pad component group.
    • Maximum Dummy Pad’s Distance from Component Pins: Dummy pad should not be apart from last component pins. Set the maximum dummy pad’s distance from component pin.
  • Soldering Direction Definition: Define the soldering direction.
    • Soldering Mark Component Group: If there is soldering mark components, select them from component group list. Using soldering mark component, users can easily define the solder direction.
      • Mark Direction: If soldering mark components are used, set the direction of soldering mark components to define the board’s soldering direction.
    • Soldering Direction: If soldering mark components are not used, set the soldering direction manually.
  • Checking
    • Check Existence of Dummy Pad: Check the existence of dummy pad for target components.
      • Check Minimum Dummy Pad Size (Dummy Pad Area): Check dummy pad’s size in defined area. If they are not enough big, they would be fails.