# Underfill

Find and examine underfill areas in BGA-type components.

Underfill is a glue filling that surrounds the BGA component. It contains the component and reduces the effects of shock. At least two continuous areas near the BGA must be noted to examine an underfill area.

More detailed information:
• Target BGA Component Layer: Select the layer where the BGA component exists.
• BGA Group: Select the BGA component.
• Table: Analyze the clearance from the BGA component to another specified component. If the result is less than the input value, it is detected.
• Underfill Clearance: Define the underfill area. Often, the underfill area is larger than the BGA clearance.
• Exclude Component Group: Exclude the specified component from analysis.
• Exclude Edge Corner Area for Underfill: Exclude the edge of the component area from the underfill. The area shown below is not considered the underfill area.
• BGA Measure Base: Select the BGA area for measurement.
• Solid Component: Analyze the clearance from the BGA pad to the solid component pad.
• Item Name: Specify the item name.
• Solid: Select a solid component.
• Base: Select the type of measurement for the solid component.
• BGA: Select the BGA component.
• Base: Set the type of measurement for the BGA component.
• BGA-Pad Clearance: Specify the clearance between the BGA pad to the solid component pad. If the result is less than the input value, it is detected.
• Overlap Ratio(%): Specify the overlap ratio. When the BGA and the solid component overlap, calculate the ratio of the BGA and the overlapping region based on the area of the solid component. If the calculated ratio is less than the input value, it is detected.
• BGA Measure Base: Select the BGA area for measurement.