- BGA
Check the rules for BGA component clearance and via placements near pins.
- Center Mark
Check the center mark existence in footprint with a certain object type.
- Clinch Spacing
Check the clearance between clinch data.
- Clinch and SR Spacing
Check the clearance between the components clinch and other pins solder mask data.
- Component Spacing
Check the clearance between component classes.
- Component Spacing2
Check the clearance between the components-based placement directions.
- DIP Annular Ring
Check the DIP type pad size ratio against the hole size.
- Direct Pin to Pin
checks two pins in same component are connected directly.
- Edge Pin Size
Check the edge pin size ratio to common pins.
- First Pin Mark
Check the existence of the components first pin mark and overlapping with other objects.
- IC Visual mark
Check the validity of design for IC visual mark in footprint.
- Min Pad Spacing in Comp
Check the minimum distance of pins in a component.
- Nearest Comp Silk
Check the silkscreens validity.
- OSP
Organic Solder Preservatives (OSP) is used on PCB to prevent exposed copper surfaces becoming oxidized.
- Pad Size
Check the size of a certain component pads.
- Pad Size by Pin Pitch
Check the pad size depending on the pin pitch for fine pin pitch components.
- Pair Comp
Check the component placement direction and compare the main component to the around component.
- Pin Count Mark
Check the existence of a pin counting mark and the interval around certain components.
- Pin Arrangement
Check the pin size and pin pitches.
- Polarity Mark
For components that should have a polarity mark, check the marks validity on design.
- Prefix Check
Check the reference names prefix in design.
- Ref Name Ordering
Check the reference name placed order.
- Ref Name Silk
Check the existence of a reference name on the silk layer.
- Reverse Placement Spacing
Check the clearance between DIP type components and other components placed on the opposite side.
- Silk Print Between Two pins
Check the existence of silkscreen between two pins of DIP type components.
- Silk to Silk
It's difficult to recognize narrow distance silkscreen, use this to check the clearance between silkscreens.
- Specific Area
Placing vias near the heat sink or crystal type components is critical in design, use this to check these type of placements.
- U Name Angle
Check the angle of each reference name silkscreen on design.
- U Name Overlap
Check reference names overlapping with other objects.
- Variant Pad Shape
Check the clearance between the variant pad, vias, routing patterns, and other objects.
