OSP

Organic Solder Preservatives (OSP) is used on PCB to prevent exposed copper surfaces becoming oxidized.

This OSP film is pasted on the component and placed with the metal mask as pair. In addition, it should be kept a clearance from the solder paste mask.

The OSP dialog contains the following sections:
  • OSP Layer Definition
    • OSP Layer: Select the OSP layer from the artwork layer list.
  • Option
    • Exclude Checking for Through-Hole Type Component
      • Exclude Checking for Through-Hole Type Component: In checking, PollEx DFM will not check for the through-hole type components.
      • Exclude Checking for Through-Hole Type Pad: In checking, PollEx DFM will not check for the through-hole type pads.
    • Exclude Checking for Specifying Component Group: Select this for the void-checking component group from the list.
  • OSP and Metal Mask Co-Existence Checking
    • Check OSP and Metal Mask coexist: Check that the components pin has OSP and metal mask data. If there is no OSP data, it will fail.
  • Clearance between OSP and Solder Mask
    • Item: Specify the item name.
    • Comp Group: Select the target component group.
    • Clearance: Set the clearance value between the target component OSP data and other solder masks.
    • Not Defined Component Group: Set the clearance value between pin OSP in components that are not defined in the table and solder masks.