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PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
Verification User Guides
This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
DFM
PollEx DFM is a board level manufacturability checking software.
Check Item Category
Component
OSP
Organic Solder Preservatives (OSP) is used on PCB to prevent exposed copper surfaces becoming oxidized.

Welcome
What's New
View new features for PollEx 2024.1.
Get Started
Learn the basics and discover the workspace.
PollEx Tutorials
Discover PollEx functionality with interactive tutorials.
PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
- Manufacture User Guides
  This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB, Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator, Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
- Modeler User Guides
  This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample, Logic, PCB, Redmark+, and Worksheet Planner.
- Solver User Guides
  This section contains the user guides for the following tools: PI, SI, SI Explorer, and Thermal.
- Verification User Guides
  This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
  - DFA
    PollEx DFA is an assembly status checking toolset for PCB design based on 3D package library.
  - DFE
  - DFE+
    PollEx DFE+ is a fully automated SI analysis tool.
  - DFM
    PollEx DFM is a board level manufacturability checking software.
    - Start DFM
      From the menu bar, click Option > DFM > Input after reading the design file to make a DFM input file.
    - Component Classification
    - Check Item Category
      - Board
      - Component
        BGA
        Check the rules for BGA component clearance and via placements near pins.
        Center Mark
        Check the center mark existence in footprint with a certain object type.
        Clinch Spacing
        Check the clearance between clinch data.
        Clinch and SR Spacing
        Check the clearance between the components clinch and other pins solder mask data.
        Component Spacing
        Check the clearance between component classes.
        Component Spacing2
        Check the clearance between the components-based placement directions.
        DIP Annular Ring
        Check the DIP type pad size ratio against the hole size.
        Direct Pin to Pin
        checks two pins in same component are connected directly.
        Edge Pin Size
        Check the edge pin size ratio to common pins.
        First Pin Mark
        Check the existence of the components first pin mark and overlapping with other objects.
        IC Visual mark
        Check the validity of design for IC visual mark in footprint.
        Min Pad Spacing in Comp
        Check the minimum distance of pins in a component.
        Nearest Comp Silk
        Check the silkscreens validity.
        OSP
        Organic Solder Preservatives (OSP) is used on PCB to prevent exposed copper surfaces becoming oxidized.
        Pad Size
        Check the size of a certain component pads.
        Pad Size by Pin Pitch
        Check the pad size depending on the pin pitch for fine pin pitch components.
        Pair Comp
        Check the component placement direction and compare the main component to the around component.
        Pin Count Mark
        Check the existence of a pin counting mark and the interval around certain components.
        Pin Arrangement
        Check the pin size and pin pitches.
        Polarity Mark
        For components that should have a polarity mark, check the marks validity on design.
        Prefix Check
        Check the reference names prefix in design.
        Ref Name Ordering
        Check the reference name placed order.
        Ref Name Silk
        Check the existence of a reference name on the silk layer.
        Reverse Placement Spacing
        Check the clearance between DIP type components and other components placed on the opposite side.
        Silk Print Between Two pins
        Check the existence of silkscreen between two pins of DIP type components.
        Silk to Silk
        It's difficult to recognize narrow distance silkscreen, use this to check the clearance between silkscreens.
        Specific Area
        Placing vias near the heat sink or crystal type components is critical in design, use this to check these type of placements.
        U Name Angle
        Check the angle of each reference name silkscreen on design.
        U Name Overlap
        Check reference names overlapping with other objects.
        Variant Pad Shape
        Check the clearance between the variant pad, vias, routing patterns, and other objects.
      - Drill Size
      - Etc.
      - FPCB
        FPCB is excellent for development of electronic components as electronic appliances are becoming miniaturized and lightweight.
      - Ground Wall
        Check the clearance for an area affected by ground wall.
      - Package
      - PAD
      - Pattern
      - Placement
      - Test Point
        Verify if the clearance between test points and other objects follow specifications and if the test points contain text.
      - Test Point2
        Analyze the clearance between a test point and each component on a board.
      - Tooling
      - Underfill
        Find and examine underfill areas in BGA-type components.
    - Result
    - Lock Input Setup
      Lock the DFM input rule file (*.DFMI) to prevent any modifications from others.
  - Logic DFE
    PollEx Logic DFE is a toolset that checks electrical validity and standardizing of schematic design.
  - Technical Cleanliness
    PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
- UPE User Guides
  This section contains the PollEx UPE user guide.
PollEx Installation Guide
Instruction to install PollEx 2024.1.
Character String Search Rule
Definition for meta character using in making sentence for searching option.

OSP

Organic Solder Preservatives (OSP) is used on PCB to prevent exposed copper surfaces becoming oxidized.

This OSP film is pasted on the component and placed with the metal mask as pair. In addition, it should be kept a clearance from the solder paste mask.

The OSP dialog contains the following sections:

OSP Layer Definition
- OSP Layer: Select the OSP layer from the artwork layer list.
Option
- Exclude Checking for Through-Hole Type Component
  - Exclude Checking for Through-Hole Type Component: In checking, PollEx DFM will not check for the through-hole type components.
  - Exclude Checking for Through-Hole Type Pad: In checking, PollEx DFM will not check for the through-hole type pads.
- Exclude Checking for Specifying Component Group: Select this for the void-checking component group from the list.
OSP and Metal Mask Co-Existence Checking
- Check OSP and Metal Mask coexist: Check that the components pin has OSP and metal mask data. If there is no OSP data, it will fail.
Clearance between OSP and Solder Mask
- Item: Specify the item name.
- Comp Group: Select the target component group.
- Clearance: Set the clearance value between the target component OSP data and other solder masks.
- Not Defined Component Group: Set the clearance value between pin OSP in components that are not defined in the table and solder masks.