Silver Paste

Check the silver paste in bending area in FPCB.



Figure 1.


Figure 2.
Screen printing with conductive ink is the newest form of FPC (called membrane) being produced today. In this application, carbon/silver (C/Ag) paste replaces the traditional copper conductor.


Figure 3.
  • Layer Definition: Define silver paste area and stiffener for top and bottom.
    • Silver Paste Top Layer: Select silver paste top layer from the artwork layer list.
    • Silver Paste Bottom Layer: Select silver paste bottom layer from the artwork layer list.
    • Stiffener Top Layer: Select stiffener top layer from the artwork layer list.
    • Stiffener Bottom Layer: Select stiffener bottom layer from the artwork layer list.
  • Checking
    • Clearance between Silver Paste and Component Pad: Set the clearance value between silver paste and component pad edge.
    • Clearance between Silver Paste and Board Outline: Set the clearance value between the silver paste and board outline.
    • Clearance between Silver Paste and Stiffener: Set the clearance value between the silver paste and stiffener.