Silver Paste TH PCB
In the case of a PCB design designed to use silver paste, it can be checked with the related design rule here.
- Can check the existence of silver paste on via.
- Can check the clearance between silver paste and solder mask.
- Can check the connected pattern structure of DIP type component.
- Silver Paste Via Definition
- Via Name: Can define via by name to check the existence on
pattern.
- Import(.txt): Apply Filter Type based on the characters
entered in the .txt file.
- Apply as a prefix when (|F|) ABC is entered in the .txt file.
- Apply as a mid-string when ABC is entered in the .txt file.
- Apply as a suffix when ABC(|P|) is entered in the .txt file.
- Export(.txt): Export the characters registered in the String Item in .txt file format.
- Import(.txt): Apply Filter Type based on the characters
entered in the .txt file.
- Via Name: Can define via by name to check the existence on
pattern.
- Silver Paste Layer: Select silver paste data on the top and bottom layer.
- Silver Paste Existence: Can define the layer for checking via which has
silver paste on both or on one side.
- Both: If via should have silver paste on Top and Bottom, choose this option.
- One Side: If Via should have silver paste on Top or Bottom, choose this option.
- Clearance to Solder Mask
- Same Net: Clearance between silver paste to solder mask, which are connected to the same net.
- Other Net: Clearance between silver paste to solder mask, which are connected to a different net.
- Clearance to silkscreen: Verify the clearance between the silver paste and silkscreen.
- Clearance to Pattern(Other Net): Verify the clearance between the silver paste and other net patterns.
- DIP Type Component
- Via Existence for Double Side Pattern: Pin of DIP type component
should be connected to the Bottom to Top through via.
Figure 1.
Figure 2.
- Via Existence for Double Side Pattern: Pin of DIP type component
should be connected to the Bottom to Top through via.