Silver Paste TH PCB

In the case of a PCB design designed to use silver paste, it can be checked with the related design rule here.

  • Can check the existence of silver paste on via.
  • Can check the clearance between silver paste and solder mask.
  • Can check the connected pattern structure of DIP type component.
  • Silver Paste Via Definition
    • Via Name: Can define via by name to check the existence on pattern.
      • Import(.txt): Apply Filter Type based on the characters entered in the .txt file.
        • Apply as a prefix when (|F|) ABC is entered in the .txt file.
        • Apply as a mid-string when ABC is entered in the .txt file.
        • Apply as a suffix when ABC(|P|) is entered in the .txt file.
      • Export(.txt): Export the characters registered in the String Item in .txt file format.
  • Silver Paste Layer: Select silver paste data on the top and bottom layer.
  • Silver Paste Existence: Can define the layer for checking via which has silver paste on both or on one side.
    • Both: If via should have silver paste on Top and Bottom, choose this option.
    • One Side: If Via should have silver paste on Top or Bottom, choose this option.
  • Clearance to Solder Mask
    • Same Net: Clearance between silver paste to solder mask, which are connected to the same net.
    • Other Net: Clearance between silver paste to solder mask, which are connected to a different net.
  • Clearance to silkscreen: Verify the clearance between the silver paste and silkscreen.
  • Clearance to Pattern(Other Net): Verify the clearance between the silver paste and other net patterns.
  • DIP Type Component
    • Via Existence for Double Side Pattern: Pin of DIP type component should be connected to the Bottom to Top through via.
      Figure 1.


      Figure 2.