Crack Pattern

In almost cases, pattern connected to pin should be thicker than a certain width and should keep its thickness within a certain distance.

Because PSR is opened at solder-mask area, the thin thickness of pattern is weak from external impact.
  • Checking
    • Item: Specify the item name.
    • Component Group: Select target components from the component group list.
    • Exclude Component Group: Select void-checking components from target components by selecting component group from the list.
    • Criteria: Select criteria to define pass or fail.
      • Minimum: If a target component pattern is thinner than the given width, it is fail.
      • Maximum: If a target component pattern is thicker than the given width, it is fail.
      • Same: If a target component pattern has the same width as the given width, it is fail.
    • Pattern Width: Specify the target pattern width for checking.
    • Distance: Define the pattern width keeping distance from the pad edge. If the pattern doesn’t keep certain width within the given distance, it is fail.


      Figure 1.
    • Pass/Fail Option: If multiple patterns are connected to one pin and even if a pattern satisfies the given condition, all connected patterns are passed.


      Figure 2.