Solder Fatigue
Description
Solder joint failure between components and the PCB due to thermal loading is a major cause of breakdown in electronic products. It is critical to estimate such fatigue failure due to the cyclic loading of solder joints. This tool automates most of the setup to predict damage to the solder joint between a component and the Printed Circuit Board (PCB) under thermal cyclic loads. The user had to create constraints and solder connections manually to finish the setup.
Method:
- Using creep energy density method proposed by Syed
- Using creep strain proposed method by Syed
- Using creep energy density method proposed by Darveaux
Number of cycles:
Number of thermal cycles considered for loading. User can input between 1 and 10 cycles.
Temperature cycle:
Profile of one thermal load cycle is required as input from the user. The profile data can be entered either manually or can imported via a CSV file by clicking the file icon. User can preview this profile by clicking the plot icon