3D IC

Electronics > Tools > Chip > 3D IC

In the electronic design automation field, a floor plan of an integrated circuit refers to a tentative placement diagram of its major functional blocks. The location of these blocks is a crucial aspect of floor planning, as it will have a significant impact on the overall performance of the design. The power consumption of each block within the system differs, leading to varying temperature distributions around them. This tool is used to set up the complete floorplan solution with chiplet stack and necessary boundary conditions like heat source, convection and materials.

Add Chiplet

Creates a new chiplet field in the dialog box where the chiplet and module parameters can be specified.

Index

Define the stack index for the chiplet, which specifies the sequence in which the chiplets are placed vertically.

Length

Define the length (x-length) of the chiplet.

Width

Define the width (y-length) of the chiplet.

Thickness

Define the thickness (in z-direction) of the chiplet.

Heat source

Define the heat source for the chiplet.

Microbumps Thickness

Define the thickness of the microbumps.

Materials

Select the material for the microbumps, substrate, and other components from their respective drop-down menus.

Convection

Define the ambient temperature and heat transfer coefficient values.

Substrate

Define length, width and thickness for the substrate.

Create Mesh

This option helps to create the fem(meshed) model.

Mesh size

Specify the mesh size to be used.

Import

Imports the XML file containing all the chiplet information.

Export

Exports all the chiplet information to an xml file.

Create Parameters

A new option has been added in the dialog that allows you to automatically generate parameters for all fields in the dialog. This includes parameters for chiplets/modules as well as all other related inputs.

When you click Create Parameters, the software will:

Example