Advanced
Description
This tool is used to create customized BGAs on user-defined solder locations along with the package and the board.
- Single type
Users can use this option to create customized BGA with unique mesh.
- BGA 3D mesh
Select the template BGA 3D mesh that needs to be copied to different solder locations.
- BGA 3D mesh
- Multiple types
Users can use this option to create customized BGA with any number of solders or BGA mesh. The .csv file should mention the model’s name for each solder location.
- Two types - Special
Users can use this option to create customized BGA with two different BGA mesh. They can choose detailed mesh for corners and simplified mesh for the rest of the regions.
- BGA at corners
Select the detailed BGA mesh used for the corners.
- BGA at rest of the regions
Select the simplified BGA mesh used for the rest of the regions.
- Corner dimension
It defines the corner region width for placing the detailed BGA mesh.
- BGA at corners
BGA locations
Select the .csv file that contains different solder locations.
Package/Board mesh size
The average element edge length of the package/board.
- Body
- Select sheet body in XY plane: Select the package sheet body. It can either be CAD or FEM.
- Dimensions
- X – Length: Package length in x-direction.
- Y – Length: Package length in y-direction.
- Thickness: Height or thickness by which the package sheet to be extruded.
- Number of layers: The number of layers of elements in the thickness direction.
- X-Length: Board length in x-direction.
- Y-Length: Board length in y-direction.
- Thickness: Height or thickness of the board.
- Number of layers: The number of layers of elements in the thickness direction.
Underfill
Option to create an extra body that surrounds the solder balls between the package and board.
Example
BGA 3D mesh template:
Package
Output
Without underfill
With underfill
BGA type:
- Single type
-
Multiple types
- Two types - Special
