Pattern

• Cavity Layer Definition
  • Define Cavity Layer Stack by Name Filter: Define a layer containing a specific character string as a Cavity area.
  • Die Component Group: Select a component group where the die parts are mounted in the package.
  • Select Etching Layer: Select a layer drawn Etching area.
• Checking
  • Item: Specify the item name.
  • Layer Stack: Select a target layer (RDL, Core, BRDL or Physical Layer).
  • Physical Layer: If selected the Physical Layer in the Layer Stack, select the Physical Layer number directly from the drop-down menu.
  • Checking Item:
    • Pattern to Pattern Clearance: Clearance checking between Patterns.
    • Pattern to Copper Clearance: Clearance checking between Pattern and Copper-Pour.
    • Pattern to Pad Clearance: Clearance checking between Pattern and Pad.
    • Pattern to Via Pad Clearance: Clearance checking between Pattern and Via Pad.
    • Copper to Copper Clearance: Clearance checking between Copper-Pours.
    • Copper to Pad Clearance: Clearance between Copper-Pour and Pad.
    • Copper to Via Pad Clearance: Clearance checking between Copper-Pour and Via Pad.
    • Pattern to Package Outline Clearance: Clearance checking between Pattern and Package Outline.
    • Copper to Package Outline Clearance: Clearance checking between Copper-Pour and Package Outline.
    • Minimum Pattern Width: Check the minimum Pattern width.
    • Minimum Via Hole Size: Check the minimum Via Hole size.
    • Minimum Via Pad Size: Check the minimum Via Pad size.
  • Except for pattern which across etching area in “Package Outline” clearance checking: Option to exclude the patterns that cross the etching area in the Pattern to Package Outline Clearance.