Electronics Thermal + Circuit(External)

The Electronics Thermal-Circuit Coupled Solution integrates advanced thermal analysis capabilities with power electronics simulation (PSIM) tools, enabling the simulation and analysis of how electronic components, particularly two-resistor components, interact with thermal management systems. In PSIM solution, the heat dissipation of two-resistor (2R) components is modeled as a function of their temperature, providing a precise representation of their thermal behavior under varying operating conditions. The Electronics Thermal solution can model systems with typical electronic components such as two-resistor component, thermal interface materials, fans, and vents. This coupled solution ensures a comprehensive understanding of the thermal performance of power electronics systems, allowing for optimized design and enhanced reliability.

The electronic components, boundary conditions, physics, and materials should be defined in the Electronics Thermal solution. The inner design and conditions of each two-resistor component should be defined in PSIM solution. The same 2R component name should be used in both solutions. In Electronics Thermal, the junction heat from each 2R component is used to calculate the updated temperature field, while in PSIM, the temperatures are used to update the heat losses of each component.

The Coupled Solution is defined in SimLab. First, the Electronics Thermal solution should be opened in SimLab. When creating the Coupled Solution, the PSIM database should be manually selected. To start the coupled simulation, use the Coupled Solution > Results > update option.