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PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
Verification User Guides
This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
DFM
PollEx DFM is a board level manufacturability checking software.
Check Item Category
Placement
Placement at Reverse Side
Verify if components are viable for reverse placement on the same board layer.

Welcome
What's New
View new features for PollEx 2025.
Get Started
Learn the basics and discover the workspace.
PollEx Tutorials
Discover PollEx functionality with interactive tutorials.
PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
- Manufacture User Guides
  This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB, Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator, Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
- Modeler User Guides
  This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample, Logic, PCB, Redmark+, and Worksheet Planner.
- Solver User Guides
  This section contains the user guides for the following tools: PI, SI, SI Explorer, and Thermal.
- Verification User Guides
  This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
  - DFA
    PollEx DFA is an assembly status checking toolset for PCB design based on 3D package library.
  - DFE
  - DFE+
    PollEx DFE+ is a fully automated SI analysis tool.
  - DFM
    PollEx DFM is a board level manufacturability checking software.
    - Start DFM
      From the menu bar, click Option > DFM > Input after reading the design file to make a DFM input file.
    - Component Classification
    - Check Item Category
      - Board
      - Component
      - Drill Size
      - Etc.
      - FPCB
        FPCB is excellent for development of electronic components as electronic appliances are becoming miniaturized and lightweight.
      - Ground Wall
        Check the clearance for an area affected by ground wall.
      - Package
      - PAD
      - Pattern
      - Placement
        AOI-AXI
        Checks components on the board that obstruct the field of vision by the height of specific parts.
        Component Count
        Calculate and display the number of placed components.
        Component on Component
        Verify the specified components placement on the board.
        Component Placement
        Define components that must be placed on a specified side of the board and locate components violating specifications.
        Component Placement Angle
        Manage the angle of the component for efficient mounting.
        Mark Placement
        Verify the placement of a specified board mark. For example, a lead-free mark, fuse mark, and so on
        Placement
        Analyze the location and orientation of a specified component on the board.
        Placement at Reverse Side
        Verify if components are viable for reverse placement on the same board layer.
        Placement Keepout
        Segment specified board areas to exclude selected objects. For example, objects such as a via, pattern, solder mask, and so on.
        Prohibited Component
        Analyze the board and locate components that are no longer available for use.
        Standard Component
        Compare the part lists between the standard part library and the used components from the design.
      - Test Point
        Verify if the clearance between test points and other objects follow specifications and if the test points contain text.
      - Test Point2
        Analyze the clearance between a test point and each component on a board.
      - Tooling
      - Underfill
        Find and examine underfill areas in BGA-type components.
    - Result
    - Lock Input Setup
      Lock the DFM input rule file (*.DFMI) to prevent any modifications from others.
  - Logic DFE
    PollEx Logic DFE is a toolset that checks electrical validity and standardizing of schematic design.
  - Technical Cleanliness
    PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
- UPE User Guides
  This section contains the PollEx UPE user guide.
PollEx Installation Guide
Instruction to install PollEx 2025.
Character String Search Rule
Definition for meta character using in making sentence for searching option.

Placement at Reverse Side

Verify if components are viable for reverse placement on the same board layer.

BGA or CSP-type components are weak to stress, so you must avoid placement on the reverse side of these fragile components.

More detailed information:

Except for SMD Pins, not having Metal-Mask: Exclude SMD Pins that do not have a metal mask from analysis.
Item: Specify the name of an item.
Component Group: Specify the component for analysis. For example, BGA, or CSP-type components.
Check Base: Select a measurement base.
- Measure (**The issue of unclear criteria for Vertical and Horizontal orientation arises when applying Pad Shape to components other than Shield Can. Therefore, Pad Shape is exclusively applied to Shield Can.)
Expand Area: Set the clearance area.
Horizontal: Set the clearance horizontal area.
Vertical: Set the clearance vertical area.
Reverse Side Component Group: Specify the component that is prohibited from placement on the reverse side of the analyzed component.
Reverse Component Check Base: Select a measurement base. (**Among the Measure Base options, Pad Shape is unavailable.)
Check Distance: Specify the distance for analysis.
Figure 1. Placement at Reverse Side Example
Inner: Allowed if components placed on the reverse side within the target component's measure base area.
Boundary: Allowed if components placed on the reverse side are overlapped with the target component's measure base.