Placement at Reverse Side

Verify if components are viable for reverse placement on the same board layer.

BGA or CSP-type components are weak to stress, so you must avoid placement on the reverse side of these fragile components.

More detailed information:
  • Except for SMD Pins, not having Metal-Mask: Exclude SMD Pins that do not have a metal mask from analysis.
  • Item: Specify the name of an item.
  • Component Group: Specify the component for analysis. For example, BGA, or CSP-type components.
  • Check Base: Select a measurement base.
    • Measure (**The issue of unclear criteria for Vertical and Horizontal orientation arises when applying Pad Shape to components other than Shield Can. Therefore, Pad Shape is exclusively applied to Shield Can.)
  • Expand Area: Set the clearance area.
  • Horizontal: Set the clearance horizontal area.
  • Vertical: Set the clearance vertical area.
  • Reverse Side Component Group: Specify the component that is prohibited from placement on the reverse side of the analyzed component.
  • Reverse Component Check Base: Select a measurement base. (**Among the Measure Base options, Pad Shape is unavailable.)
  • Check Distance: Specify the distance for analysis.


    Figure 1. Placement at Reverse Side Example
  • Inner: Allowed if components placed on the reverse side within the target component's measure base area.
  • Boundary: Allowed if components placed on the reverse side are overlapped with the target component's measure base.