OS-E: 0895 Flat Plate with Thermal Compliance Response
Demonstrates the usage of thermal compliance responses with Topology Optimization in OptiStruct.
A flat plate structure is considered which is subject to a heat flux input on the
entire surface (defined by CHBDYE elements). The middle section
of the top edge of the plate is maintained at a constant temperature. Topology
optimization is performed, and results of element densities are obtained.
Model Files
Before you begin, copy the file(s) used in this example to
your working directory.
Model Description
- Element Type
- CQUAD4, CHBDYE
The material properties for the plate are:
- Material Properties
- Value
- Young's modulus
- 210000 Nmm2
- Poisson's ratio
- 0.30
- Thermal expansion coefficient
- 1.0E-05 K-1
- Thermal conductivity
- 401.0 W mm-1 K-1
- Free convection heat transfer coefficient
- 25.0 W mm-2 K-1
Optimization Formulation
- Objective
- Minimize thermal compliance (TCOMP)
- Constraint
- Volume fraction (VOLFRAC) ≤ 0.3