Altair PollEx 2024 Release Notes
Highlights
- Added a new checking item of Rigid-Flex PCB in the FPCB category of DFM to check the design rules in the Flexible area such as PCB Outline radius, solid copper plane, and Reinforcing copper.
- Added a feature to import the UPF libraries from Ultra Librarian in the Parts dialog of PollEx PCB.
- Added a cross-probe feature in Technical Cleanliness between hazardous analysis results in PCB and the ECAD tool.
- Added the Electrical Conductor Spacing item in DFE. When conducting spacing checks between two nets, it is now possible to specify an appropriate spacing value based on the voltage difference between the two nets. Additionally, spacing checks can be performed with different spacing values depending on the solder mask open status of the nets. Using this item, we can check whether there is a possibility of sparks occurring between nets.
- Enhanced the Zuken CR-8000/CR-5000 importer to support the Solder Resist layer, and to recognize the sub-mesh of the copper polygon shapes.
New Features
- PollEx Modeler
- PCB
- Added a feature to import the UPF libraries from Ultra Librarian in the Parts dialog of PollEx PCB.
- PollEx Verification
- DFM
- Added a new checking item of Rigid-Flex PCB in the FPCB category of DFM to check the design rules in the Flexible area such as PCB Outline radius, solid copper plane, and Reinforcing copper.
Enhancements
- PollEx Modeler
- PCB
- Added the Number of Pins and Net Length Status attributes in the Net Length Viewer dialog.
- ECAD Interface
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- Enhanced the Cadence Allegro Importer to recognize the default Board Outline Layer Name as DESIGN_OUTLINE.
- Enhanced the Cadence Allegro importer to distinguish between the default and subclass layers.
- Enhanced the Zuken CR-8000/CR-5000 importer to support the Solder Resist layer.
- Enhanced the Zuken CR-8000/CR-5000 importer to recognize the sub-mesh of the copper polygon shapes.
- Enhanced text spacing in Siemens Xpedition importer.
- Enhanced the layer setup in Siemens Xpedition Binary importer to recognize CONTOUR objects as the Hole.
- Enhanced the Siemens Xpedition Binary importer to import the Generated Silkscreen layers.
- Changed the Copper Layer Name format to SIGNAL_# for Siemens Xpedition ASCII importer to match with the original Xpedition data layer name.
- PollEx Verification
- DFM
- Added an option in the Under Hole/Via item to check if the slit hole exists in the specific component area.
- Added an option in the Hole Distance item to check Solder Mask Annular ring size of the NPTH.
- Added an option in the Conformal Coating item to check the minimum count of NPTH by the hole size in a specific component area.
- Added an option in the Under Hole/Via item to define the target objects using Padstack String Filter.
- Added an option in the Hole Through Pad item to check "Except Via in Pad Area" by classifying SMD and NSMD pads.
- Added an option in the Under Hole/Via item to expand the area of the target component.
- Added an option in the Placement Mark item to check the alignment of the placement mark between two components.
- Added an option in the Min Width item to check all the segments in target Nets.
- Added an option in the Min Width item to check the bottleneck of the route pattern.
- Added an option in the Min Width item to check the minimum width of the Line and Arc objects separately on the route patterns.
- Added an option in the Min Width item to allow shorter route patterns than the length limit.
- Added an option in the Via S/R Spacing item to check the clearance between via solder mask and figure solder mask.
- Added an option in the Component Placement Angle item to check the component placement angle based on the SMT soldering direction.
- Added an option in the Guide Hole item to define the guide holes using Padstack String Filter.
- Enhanced the PCB Outline Measure Base option in the PCB Outline Spacing item.
- Added an option in the Acute Angle item to exclude route pattern segments connected to the copper plane.
- Added an option in the Lines Between Two Pins item to exclude copper planes from the target objects.
- Added an option in the Dip Annular Ring item to check the existence of non-functional pads on the inner layer.
- Added an option in the Via Annular Ring item to check the existence of non-functional pads on the inner layer.
- Added an option in the Jig Hole item to check specific hole existence on the center of the PCB Board.
- Added an option in the Solder Resist Pad item to check the distance between Pad and Solder Mask by classifying SMD and NSMD pads.
- Enhanced the Test Point 2 item result to include the layer information.
- Added an option in the Bending Area item to check maintained straight patterns within the transition area.
- Enhanced the Layer Definition in the Min Same Net Spacing and Width item.
- Added an option in the Via Annular Ring item to define the target Via types.
- Added an option in the Unrouted Net item to separate Pattern Connection check.
- PollEx Solver
- SI
- Added an Assign Pin Paring Information menu button in the Parts dialog. This menu automatically pairs pins connected to nets with a Net Type set to Diff Pair even when an IBIS model is not connected.
- Added a Use Simple Models option in the Network Analysis feature to perform analysis without using buffer models, instead utilizing voltage sources and terminations as driver/receiver models.
- Enhanced a feature in the Net Topology Analyzer to allow Net Topology creation for objects with many nodes, such as ground.
- Enhanced a feature in Network Analysis to automatically adjust the simulation time to an appropriate value when changing the operating frequency during the waveform analysis.
Resolved Issues
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- Fixed a bug that some STEP-REPEAT information is missing in the ODB++ importer of PCB.
- Fixed bugs of Simens Xpedition Binary importer such as missing Fiducial Mark, wrong Component Height Value, missing Placement Obstruct objects from the Keepout Layer, missing Copper shape in the Dummy Pad, missing Cell Properties, and missing Fiducial Mark.