Keep Off Pair Comp

This DFE rules checks for those components that are not placed far enough.

Some of the components may cause bad effects on others. Those components must be placed with caution. If they are very weak against ESD problem, they should be placed apart from board edges. Power around the area where densely populated large power consuming components are placed is unstable. Careful component placement consideration is needed near those components in the high-power consuming area to achieve receiving stable power.

Allow bigger component spacing near the high heat dissipating components.
  • Item: Enter the item name.
  • Comp1: Assign the first component group.
  • Net of Comp1: Assign the nets that are connected to the first component group for selecting pin of target IC.
  • Measure Base of Comp1: Select measurement position.
    • Pin Shape: Measure pin separation pin edge to edge.
    • Pin Location: Measure pin separation pin center to center.
    • COC: Measure IC separation with COC.
    • SILK: Measure IC separation with SILK.
    • ALL Pad Shape: Measure IC separation with Pin PAD.
  • Comp2: Select the second component.
  • Net of Comp2: Assign the nets that are connected to the second component group for selecting pin of target IC.
  • Measure Base of Comp2: Select measurement position.
    • Pin Shape: Measure pin separation pin edge to edge.
    • Pin Location: Measure pin separation pin center to center.
    • COC: Measure IC separation with COC.
    • SILK: Measure IC separation with SILK.
    • ALL Pad Shape: Measure IC separation with Pin PAD.
  • Clearance: Assign clearance criteria.
  • Layer: Define check layer method.
    • Same Layer: Check for the same layer on which components are placed.
    • Opposite Layer: Check for the opposite layer of the layer on which components are placed.
    • Any Layer: Check for distance on all (any) layers.

Test Cases

  • Case1: If there are EMI sensitive components, it is better to have enough clearance.
  • Case2: If large power consuming components are placed densely, the power around them is unstable. To get a stable power supply, the designer must carefully consider a proper component placement.
  • Case3: For the placement of high heat emitting components, the designer should consider bigger clearances among those components to spread out the heat.