Analysis Part Setup Dialog Parameters

Figure 1.
  1. Device Model Files: Specify/register the IC models in the form of IBIS, SPICE, HSPICE, Linear Device, S/Y/Z Parameters, and RLC Package Parasitic for signal and power integrity simulations.
  2. Passive Component Data: Specify passive part models in the form of RLC, SPICE, and S/Y/Z Parameters for signal and power integrity simulations.
  3. Power Rails: Specify the power rail properties for power integrity simulation.
  4. Package Thermal: Specify the package thermal properties for thermal analysis.
  5. Package Pin Parasitic Modeler: Use for defining complex package pin RLC parasitic models for signal and power integrity simulations.
  6. Linear Device Modeler: Use for defining simple linear I/O device models for IC pins for signal and power integrity simulations.
    Click Package Thermal. The Package Thermal dialog displays. Define thermal properties of a component part, such as maximum power dissipation of the device and compact package thermal model data.

    Figure 2.
    • Max power dissipation: The device maximum power dissipation.
    • Max operating temperature: The device maximum operating temperature allowed.
    • Min operating temperature: The device minimum operating temperature allowed.
    • Package Geometry: The package geometry values. If you do not enter them, default values are used for thermal analysis.
    • Compact Thermal Model: PollEx Thermal supports Two-Resistor Model and DELPHI Model. A DELPHI model is more complex than a Two-Resistor model and harder to obtain. Click Model Data. The Two-Resistor dialog displays.

      Figure 3.
    Junction-to-case and Junction-to-board thermal resistance values are automatically filled with default values based on the part's Package Type assigned in Analysis Part Setup. You can replace the default values with more accurate values, if available.