Analysis Part Setup Dialog Parameters

Figure 1.
- Device Model Files: Specify/register the IC models in the form of IBIS, SPICE, HSPICE, Linear Device, S/Y/Z Parameters, and RLC Package Parasitic for signal and power integrity simulations.
- Passive Component Data: Specify passive part models in the form of RLC, SPICE, and S/Y/Z Parameters for signal and power integrity simulations.
- Power Rails: Specify the power rail properties for power integrity simulation.
- Package Thermal: Specify the package thermal properties for thermal analysis.
- Package Pin Parasitic Modeler: Use for defining complex package pin RLC parasitic models for signal and power integrity simulations.
-
Linear Device Modeler: Use for defining simple linear I/O device models for IC
pins for signal and power integrity simulations.
Click Package Thermal. The Package Thermal dialog displays. Define thermal properties of a component part, such as maximum power dissipation of the device and compact package thermal model data.
Figure 2.- Max power dissipation: The device maximum power dissipation.
- Max operating temperature: The device maximum operating temperature allowed.
- Min operating temperature: The device minimum operating temperature allowed.
- Package Geometry: The package geometry values. If you do not enter them, default values are used for thermal analysis.
- Compact Thermal Model: PollEx Thermal supports Two-Resistor Model and
DELPHI Model. A DELPHI model is more complex than a Two-Resistor model
and harder to obtain. Click Model Data. The
Two-Resistor dialog displays.
Figure 3.