Power Integrity Analysis Parameters

Power Integrity Constraints

Figure 1.


  • Starting frequency (MHz): lower bound of frequency range in MHz.
  • Middle frequency (MHz): middle point of frequency range in MHz.
  • Ending frequency (MHz): upper bound of frequency range in MHz.
  • Low frequency sweep type: low frequency range sampling method (linear, decade).
  • Number of low frequency points per decade: n number of frequency points per decade or frequency point interval in MHz for linear sampling at low frequency range.
  • High frequency sweep type: high frequency range sampling method (linear, decade).
  • Total number of high frequency points: number of frequency points per decade or frequency point interval in MHz for linear sampling at high frequency range.
  • Default DC current of power pin (mA): default DC sink current of PIN for IR-Drop analysis.
  • Default allowable DC voltage drop (V): default allowable DC voltage drop value for IR-Drop analysis.
  • Default target impedance (Ohm): default target impedance for PDN analysis.
  • Default target starting frequency (MHz): default target impedance start frequency for PDN analysis.
  • Default target ending frequency (MHz): default target impedance end frequency for PDN analysis.
  • Default power/ground via padstack: select default power/ground via pad-stack for PDN analysis.
  • Choose the following for IR drop analysis mesh type:
    • Polygon: only polygon types are meshed when conducting IR drop analysis.
    • Polygon+Trace (default): both polygon and trace types are meshed when conducting IR drop analysis.
  • Choose the following for IR drop analysis:
    • PIN: only pins of a component are considered, specifically the interactions between pins during IR drop analysis.
    • DIE: only the interactions between the pins of a component, but also the parasitic value of the DIE package are taken into account during IR drop analysis.
  • IR drop analysis mesh parameter: define mesh size used for IR-Drop analysis. The larger the number, the smaller the mesh size.
  • Port Number for Analysis:
    • Individual Ports: when selecting, the user directly designates and uses power pins for PDN analysis.
    • Port Groups: when selected, the port is designated by making the entire Power Pin of component into one group during PDN analysis.
  • Composite Components:
    • In Composite Components, you can specify each component to be automatically included in the composite. For example, if you set up Resistor and Custom Series Designator, the tool will automatically group components with reference names that begin with the designated initials of the Resistor and Custom Series Designator and a PIA will be generated accordingly. If you prefer not to apply this setting, simply uncheck the option.
  • Source Component:
    • In Source Component, you can set up a Source Component by designating a default reference name initially. For example, if you specify "CN*" (Connector), any component with a reference name starting with "CN" will automatically be classified as a Source Component, and a PIA will be generated accordingly.