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PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
Verification User Guides
This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
DFM
PollEx DFM is a board level manufacturability checking software.
Check Item Category
PAD
Dummy Pad
Check existence of dummy pads.

Welcome
What's New
View new features for PollEx 2024.1.
Get Started
Learn the basics and discover the workspace.
PollEx Tutorials
Discover PollEx functionality with interactive tutorials.
PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
- Manufacture User Guides
  This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB, Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator, Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
- Modeler User Guides
  This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample, Logic, PCB, Redmark+, and Worksheet Planner.
- Solver User Guides
  This section contains the user guides for the following tools: PI, SI, SI Explorer, and Thermal.
- Verification User Guides
  This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
  - DFA
    PollEx DFA is an assembly status checking toolset for PCB design based on 3D package library.
  - DFE
  - DFE+
    PollEx DFE+ is a fully automated SI analysis tool.
  - DFM
    PollEx DFM is a board level manufacturability checking software.
    - Start DFM
      From the menu bar, click Option > DFM > Input after reading the design file to make a DFM input file.
    - Component Classification
    - Check Item Category
      - Board
      - Component
      - Drill Size
      - Etc.
      - FPCB
        FPCB is excellent for development of electronic components as electronic appliances are becoming miniaturized and lightweight.
      - Ground Wall
        Check the clearance for an area affected by ground wall.
      - Package
      - PAD
        Copper Connected Pad
        Check specified components pattern connected pin area ratio.
        Copper Keep-out Around Pad
        Dummy Pad
        Check existence of dummy pads.
        Dummy Pad2
        Check different type of dummy pad existence in design.
        Hole Through Pad
        Check holes placed on component pads.
        Metal Mask
        Check the metal mask design rules.
        Minimum Via Land Size
        Check size of Via's land.
        Multiple Pattern Connect
        Check target component’s pattern connecting status.
        PSR Covered Via
        Check Vias are covered with PSR or solder mask.
        Silk on Pad
        Check if silkscreen data are overlapped with pads.
        Solder Resist Pad
        Solder Resistor (SR) is a material which is applied to specific areas of the printed circuit board during a soldering process and protects the circuit of the unnecessary portions of solder.
        Teardrop
        Check rule related to teardrop in design.
        Thermal Pad
        Check rule for component thermal pads.
        Via Annular Ring
        Check the annular ring, the distance between pad and HOLE size.
        Via Overstack
        Check the number of layers for drilling operation.
        Via Spacing
        Depending on the via type, check different clearance to different PCB objects.
        Via Spacing 2
        Check via clearance depending on via size.
        Via S/R Spacing
        Check the distance between solder mask in via to other pads.
        Wave Mark
        Check wave mark in the FPC component edge.
      - Pattern
      - Placement
      - Test Point
        Verify if the clearance between test points and other objects follow specifications and if the test points contain text.
      - Test Point2
        Analyze the clearance between a test point and each component on a board.
      - Tooling
      - Underfill
        Find and examine underfill areas in BGA-type components.
    - Result
    - Lock Input Setup
      Lock the DFM input rule file (*.DFMI) to prevent any modifications from others.
  - Logic DFE
    PollEx Logic DFE is a toolset that checks electrical validity and standardizing of schematic design.
  - Technical Cleanliness
    PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
- UPE User Guides
  This section contains the PollEx UPE user guide.
PollEx Installation Guide
Instruction to install PollEx 2024.1.
Character String Search Rule
Definition for meta character using in making sentence for searching option.

Dummy Pad

Check existence of dummy pads.

Small pin-pitch SMD components use dummy pads to prevent solder-short. Commonly they placed at the opposite direction against soldering direction.

Target Layer Definition: Define target checking layer.
- Top/Bottom: Select target layer between top and bottom.
Target Component Definition: Define target components.
- Maximum Pin Pitch of Target Components: Set the maximum pin pitch value of components.
Dummy Pad Definition: Define dummy pad’s properties.
- Solder Mask Area (Minimum MS Value): Set the minimum x(y) axis size of solder mask. It means dummy pads should have solder mask.
- Dummy Pad Component Selection: If dummy pads are registered with component, select dummy pad component group.
- Maximum Dummy Pad’s Distance from Component Pins: Dummy pad should not be apart from last component pins. Set the maximum dummy pad’s distance from component pin.
Soldering Direction Definition: Define the soldering direction.
- Soldering Mark Component Group: If there is soldering mark components, select them from component group list. Using soldering mark component, users can easily define the solder direction.
  - Mark Direction: If soldering mark components are used, set the direction of soldering mark components to define the board’s soldering direction.
- Soldering Direction: If soldering mark components are not used, set the soldering direction manually.
Checking
- Check Existence of Dummy Pad: Check the existence of dummy pad for target components.
  - Check Minimum Dummy Pad Size (Dummy Pad Area): Check dummy pad’s size in defined area. If they are not enough big, they would be fails.