Lead

Lead to Hole

Checks the clearance between the DIP type component’s lead and hole. If there is not enough clearance, it results in soldering defect.

Figure 1.

• Check Layer: Select checking target layer.
• Item: Input item name.
• Group: Specify the target group name. You can select the group from the list. x.
• Check Type
  • Minimum: Set the minimum clearance between Lead and Hole.
  • Maximum: Set the maximum clearance between Lead and Hole.

    
    
    Figure 2.

• Circle Clearance: Enter the clearance for circular hole.
• Ellipse Clearance: Enter the clearance for ellipse hole.

Lead Length

Checks the length of DIP type component’s lead. If it is much longer than the allowable length, PollEx DFA can detect it.

Figure 3.

• Check Layer: Select checking target layer.
• Item: Input item name.
• Group: Specify the target group name. You can select the group from the list.

  
  
  Figure 4.

• Allowable Length: Input allowable lead length.

Package Pin & Footprint

Checks the distance between package lead and footprint pad. Inspects toe-print, heel-print, and side distance.

Figure 5.

• Check Layer: Select checking target layer.
• Item: Input item name.
• Group: Specify the target group name. You can select the group from the list.

  
  
  Figure 6.

• Toe: Distance from package leads edge to footprint pad’s outer edge. If the measured distance is smaller than the given value, it fails.
• Heel: Distance from package leads edge to footprint pad’s inner edge. If the measured distance is smaller than the given value, it fails.
• Side: Distance from package leads edge to footprint pad’s side edge. If the measured distance is smaller than the given value, it fails.