Board

PCB Outline Spacing

Checks the clearance between board contour and placed package shape.

Figure 1.

• Check Layer: Select checking target layer.
• Item: Input item name.
• Component Group: Specify checking target component group.

  
  
  Figure 2.

• Exception Comp: Specify checking-exception component group.

  
  
  Figure 3.

• Clearance: Define the clearance distance between board contour and package.
• Condition: Select the measurement base for package.
  • Both: Dimension including package body and lead.
  • Body: Package body.
  • Lead: Package lead.

Board Outline Spacing

Checks the clearance between array board contour and single board’s components.

Figure 4.

• Check Layer: Select checking target layer.
• Group Division

  
  
  Figure 5.

  • Item: Input item name.
  • Component Group: Specify target component group.

    
    
    Figure 6.

  • Component Height: Use the component with a height that is within the set range as a checking target among selected components.

    
    
    Figure 7.

  • Exception Component: Specify checking-exception component group.

    
    
    Figure 8.

  • Top Clearance: Define package clearance with array board’s top.
  • Bottom Clearance: Define package clearance with array board’s bottom.
  • Left Clearance: Define package clearance with array board’s left side.
  • Right Clearance: Define package clearance with array board’s right side.
  • Soldering Comp Group: If you use soldering direction component, specify the GROUP to define the direction.
  • Soldering Direction: If soldering direction showing component is not used, you can directly define the direction of soldering.