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PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
Verification User Guides
This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
DFM
PollEx DFM is a board level manufacturability checking software.
Check Item Category
Pattern
Silver Paste TH PCB
In the case of a PCB design designed to use silver paste, it can be checked with the related design rule here.

Welcome
What's New
View new features for PollEx 2024.1.
Get Started
Learn the basics and discover the workspace.
PollEx Tutorials
Discover PollEx functionality with interactive tutorials.
PollEx User Guides
Discover PollEx functionality with comprehensive user guides.
- Manufacture User Guides
  This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB, Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator, Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
- Modeler User Guides
  This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample, Logic, PCB, Redmark+, and Worksheet Planner.
- Solver User Guides
  This section contains the user guides for the following tools: PI, SI, SI Explorer, and Thermal.
- Verification User Guides
  This section contains the user guides for the following tools: DFA, DFE, DFE+, DFM, and Logic DFE.
  - DFA
    PollEx DFA is an assembly status checking toolset for PCB design based on 3D package library.
  - DFE
  - DFE+
    PollEx DFE+ is a fully automated SI analysis tool.
  - DFM
    PollEx DFM is a board level manufacturability checking software.
    - Start DFM
      From the menu bar, click Option > DFM > Input after reading the design file to make a DFM input file.
    - Component Classification
    - Check Item Category
      - Board
      - Component
      - Drill Size
      - Etc.
      - FPCB
        FPCB is excellent for development of electronic components as electronic appliances are becoming miniaturized and lightweight.
      - Ground Wall
        Check the clearance for an area affected by ground wall.
      - Package
      - PAD
      - Pattern
        1 Pin Nets
        Scan the Net List on PCB data and detect the net which is connected to only 1 pin.
        Acute Angle
        Check the Angle formed by objects and segments
        Connected Pad
        This section examines whether the ratio of the connection of pad and pattern is outside the defined value.
        Connected Pattern Direction
        Check the pattern opposite routed directions.
        Copper Boundary Width
        Checks the outline width of copper-pour data.
        Crack Pattern
        In almost cases, pattern connected to pin should be thicker than a certain width and should keep its thickness within a certain distance.
        Intermediate Pattern
        Check the thickness which deviates from the pad edge.
        Keep Out Pattern
        Check routing status from certain components.
        Lines Between Two Pins
        Check the number of patterns, the distance between pins, and the distance between pin and patterns.
        Mechanical Short
        Check an electrical short of different routing patterns.
        Min Same Net Spacing and Width
        Check the minimum spacing between copper objects and the copper width.
        Minimum Width
        Check the pattern minimum width.
        Net to Net
        Check the clearance between net to net.
        Object to Object
        Wiring designed by Artwork mode is recognized as objects and not nets, but it is required to keep the clearance between object to object.
        Pad to Net
        Check a component pin clearance with various objects on design.
        Silver Paste TH PCB
        In the case of a PCB design designed to use silver paste, it can be checked with the related design rule here.
        Unrouted Net
        This item can detect the dangling net and check the connected net to see if the net is completely connected to pin or not.
        Void Coverage
        Check the void coverage with hole placed to copper plane.
      - Placement
      - Test Point
        Verify if the clearance between test points and other objects follow specifications and if the test points contain text.
      - Test Point2
        Analyze the clearance between a test point and each component on a board.
      - Tooling
      - Underfill
        Find and examine underfill areas in BGA-type components.
    - Result
    - Lock Input Setup
      Lock the DFM input rule file (*.DFMI) to prevent any modifications from others.
  - Logic DFE
    PollEx Logic DFE is a toolset that checks electrical validity and standardizing of schematic design.
  - Technical Cleanliness
    PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
- UPE User Guides
  This section contains the PollEx UPE user guide.
PollEx Installation Guide
Instruction to install PollEx 2024.1.
Character String Search Rule
Definition for meta character using in making sentence for searching option.

Silver Paste TH PCB

In the case of a PCB design designed to use silver paste, it can be checked with the related design rule here.

Can check the existence of silver paste on via.
Can check the clearance between silver paste and solder mask.
Can check the connected pattern structure of DIP type component.

Silver Paste Via Definition
- Via Name: Can define via by name to check the existence on pattern.
Silver Paste Layer: Select silver paste data on the top and bottom layer.
Silver Paste Existence: Can define the layer for checking via which has silver paste on both or on one side.
- Both: If via should have silver paste on Top and Bottom, choose this option.
- One Side: If Via should have silver paste on Top or Bottom, choose this option.
Clearance to Solder Mask
- Same Net: Clearance between silver paste to solder mask, which are connected to the same net.
- Other Net: Clearance between silver paste to solder mask, which are connected to a different net.
Clearance to silkscreen: Verify the clearance between the silver paste and silkscreen.
Clearance to Pattern(Other Net): Verify the clearance between the silver paste and other net patterns.
DIP Type Component
- Via Existence for Double Side Pattern: Pin of DIP type component should be connected to the Bottom to Top through via.
  Figure 1.
  
  Figure 2.