This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB,
Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator,
Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample,
Logic, PCB, Redmark+, and Worksheet Planner.
PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
PollEx Technical Cleanliness (TC) is an optional module of the PollEx PCB and a reliability analysis tool set for hazardous areas on a PCB design, using its micro particles.
From the menu bar, click Verification > Technical Cleanliness > Input.
Note: You have to import the design file before selecting the
Input option. Refer to PollEx
PCB manual for design file import.
The PollEx TC main dialog window displays the
Input tab with the following panels:
Analysis
Analysis queue
Target Object
Figure 1.
Analysis
PollEx TC perform analysis using parameter from the particle
definition and the target object. Once parameter is created and provided as an
input, it can be added to the queue list for analysis.
Figure 2.
The Analysis panel provides:
Particle Definition: Define the particle size.
Size: Enter the particle size to be analyzed. The larger the
particle size value, the more time required to analyze the hazard
area.
Add to Analysis Queue: Add the parameter to the table listed on the Analysis
queue panel. Figure 3.
When an analysis is performed a Progress bar tracks the status of the each input
parameter as shown below
Figure 4.
Analysis Queue
Analysis queue lists the parameters for the particle size and selected target object
scale to analyze. This menu helps edit or delete the data setting list.
Figure 5.
The analysis queue has the following options:
Edit: Edits a selected parameter. Figure 6.
Delete: Deletes a selected parameter from the queue.Figure 7.
Target Object
Target Object defines the selected area and level.
Figure 8.
It has two options namely:
Measure Base: Selects the area which will be measured. There are three bases
available, Pad/SolderMask Overlap, SolderMask, and Pad. Figure 9.
Division Scale: Sets the partition size of the object (Copper) required for
the hazard area analysis. The smaller the size of the partition the more
precise the inspection.