Underfill

Underfill is a method of filling a thermo-hardening resin (epoxy) between the PCB’s top side and the chip’s bottom side to produce sound mechanical and thermal properties, and to protect the package chips from physical or thermal shock to ensure reliability. Underfill is widely used with the portable devices that received a lot of physical shock or with the high-speed communication devices that received a lot of thermal shock.

In the underfill process, the movement path of the nozzle and applied amount of the thermo-hardening resin can be set by the engineer to the bottom side of the part through the underfill dispenser equipment.