Stackup

From the menu bar, click Properties > Layer Stack. The Layer Stack dialog opens. This menu shows PCB’s physical stacked information will be used for analysis. The stacking order, thicknesses, and material properties of metallic and dielectric layers are core parameters drawing dramatic changes of signal transmission qualities and thermal distribution over PCB systems. Therefore, precise assignment should be given to Type, Thickness, Conductor/Dielectric Material, and the total thickness should be checked to see if it shows the proper value. The value of thickness can be entered after double-clicking the area of numbers assigned. Other parameters can be defined by clicking and selecting one of the drop-down values. Layer Type for power plane should be defined as Power and ground plane as Ground. Available layer types are coating, dielectric, signal, micro signal, power, ground, and floating layers. Each layer type is described below:

• Coating: Conformal coating material applied to protect the top and bottom signal layers.
• Dielectric: Dielectric layer between two conductor layers. Multiple dielectric layers can be placed next to each other
• Signal: Etched signal layer. Core signal layer when microvias are used.
• Micro Signal: For boards using microvias. Micro signal layers are made on both sides of board. Microvias are used for connecting micro signal layers or connecting a micro signal layer and the first core layer.
• Power: Power plane layer.
• Ground: Ground plane layer.
• Floating: Floating conductor plane layer.
• Often the top and bottom widths of etched conductor trace cross-section are different, resulting in a trapezoidal cross-section shape.

Figure 1.