Size Dimension
Definition if the Pin Pad Size Input Type is Size Dimension.
In the case of BGA type, only the Top Layer needs to be defined.
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Top Layer: Define the pad shape and size for the top layer.
- Solder Resist: Define the solder resist pad size using margin from the pad.
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Unconnected pad: Define the unconnected pad shape and size.
- If unconnected pad is needed, select the check box.
- Define the pad shape and size.