Size Dimension

Definition if the Pin Pad Size Input Type is Size Dimension.

  1. Top Layer: Define the pad shape and size for the top layer.
    Figure 1.


    1. Connect Pad: Define the connected pad shape and size of the top layer.
      • Pad Shape: Define connected pad shape from Circle, Rectangle, Oblong, or Rounded Rectangle.
      • Define size: Circle (diameter), Rectangle/Oblong (width and height), and Rounded Rectangle (width, height, and rounded corner radius) respectively.
      Figure 2.


  2. Solder Resist: Define the solder resist pad size using margin from the pad.
    Figure 3.


  3. Unconnected pad: Define the unconnected pad shape and size.
    1. If unconnected pad is needed, select the check box.
    2. Define the pad shape and size.
  4. Thremal pad: Define the thermal pad shape and size.
    1. If thermal pad is needed, select the check box.
    2. Thermal pad shape: Select the thermal pad shape.
      Circle and Square shapes available.
    3. Number of spokes: Select the counts of spokes (2 or 4).
    4. Spoke width: Define the width of the spoke.
    5. Anti-Pad Margin from Drill Hole: Define the pad margin from drill hole.
      Figure 4.


  5. Bottom layer: Define the pad shape and size for the bottom layer.
    The definition method is the same as the top layer.
  6. Inner signal layer: Define the pad shape and size for the inner signal layer.
    The definition method is the same as the top layer, with the additional option for solder resist definition.
  7. Inner plane layer: Define the pad shape and size for the inner plane layer.
    The definition method is the same as the top layer, with the additional option for solder resist definition.
  8. Drill Hole: Define the drill hole shape and size.