Etchback

Check for the etching process that removes the wiring connected to the electroplating on the pad during the package manufacturing process.

  • Etching / Plating Bar Layer Definition
    • Select Etching layer for Top side: Select the etching layer drawn on the top side.
    • Select Etching layer for Bottom side: Select the etching layer drawn on the bottom side.
    • Select Etching layer for Inner layer: Select the etching layer drawn on the inner layer.
    • Select Platting Bar layer: Select the layer where the platting bar area is drawn.
  • Checking: Set the checking rules for each Top, Bottom and Inner layers.
    • Minimum Etching area width: Minimum width checking of objects drawn on the etching area.
      Figure 1.


    • Etching area Clearance to other Etching area: Minimum clearance checking between objects drawn on the etching area.
      Figure 2.


    • Etching area Clearance to user Defined Layer Objects: Clearance checking between objects drawn in the etching area and in the user defined layer.
    • Etching area Clearance to Pattern: Clearance checking between etching area and pattern but excluding the pattern segment directly connected to the etching area.
      Figure 3.


    • Etching area Clearance to Copper: Clearance checking between etching area and copper polygon.
    • Etching area Clearance to Solder Mask: Clearance checking between etching area and solder mask.
      Figure 4.


    • Check Pattern width in Etching area: Check whether the pattern overlapped with the etching area is designed within the user defined width.
      Figure 5.


    • Checking Plating Bar connection with Net which connected with S/R Pad: Check whether the Net connected to S/R opened pad is connected to the plating bar.
    • Checking Short Nets after Etching: Check whether the shorted net exists after the etching process.