Board

PCB Outline Spacing

Checks the clearance between board contour and placed package shape.

Figure 1.


  • Check Layer: Select checking target layer.
  • Item: Input item name.
  • Component Group: Specify checking target component group.
    Figure 2.


  • Exception Comp: Specify checking-exception component group.
    Figure 3.


  • Clearance: Define the clearance distance between board contour and package.
  • Condition: Select the measurement base for package.
    • Both: Dimension including package body and lead.
    • Body: Package body.
    • Lead: Package lead.

Board Outline Spacing

Checks the clearance between array board contour and single board’s components.

Figure 4.


  • Check Layer: Select checking target layer.
  • Group Division
    Figure 5.


    • Item: Input item name.
    • Component Group: Specify target component group.
      Figure 6.


    • Component Height: Use the component with a height that is within the set range as a checking target among selected components.
      Figure 7.


    • Exception Component: Specify checking-exception component group.
      Figure 8.


    • Top Clearance: Define package clearance with array board’s top.
    • Bottom Clearance: Define package clearance with array board’s bottom.
    • Left Clearance: Define package clearance with array board’s left side.
    • Right Clearance: Define package clearance with array board’s right side.
    • Soldering Comp Group: If you use soldering direction component, specify the GROUP to define the direction.
    • Soldering Direction: If soldering direction showing component is not used, you can directly define the direction of soldering.