This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB,
Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator,
Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
Block JIG Generator is used for the purpose of stable supporting the bare PCB and evenly applying lead in the screen printer equipment
that prints the solder cream during the SMD process.
Use Make Board Paneling to modify the data designed with a single sub board into an array type to use manufacturing
related features, such as Metal Mask Manager, Mounting Emulator, Block JIG Generator, and Router-Machine JIG Generator.
Metal Mask Manager is a tool that can register standard metal mask database, manage metal mask changing history, and check differences
between design and standard metal mask.
The PollEx Mounting Data Extractor function extracts components and PCB information for chip mounter from PCB design data. It is included in the PollEx PCB Modeler.
The Solder Quantity Calculator provides evidence to get numerical calculation and solder quantity based on whole mask space and user-defined
conditions.
This section contains the user guides for the following tools: BOM, CAM, Component Arrangement Plan, CP, Golden Sample,
Logic, PCB, Redmark+, and Worksheet Planner.
This section contains the user guides for the following tools: Block JIG Generator, Compare GDSII, Gerber to PCB,
Make Board Paneling, Metal Mask Manager, Mounting Data Extractor, Mounting Emulator, Router-Machine JIG Generator,
Solder Quantity Calculator, Soldering Pallet, Test Point Location Generator, and Underfill.
The Solder Quantity Calculator provides evidence to get numerical calculation and solder quantity based on whole mask space and user-defined
conditions.
The Solder Quantity Calculator provides evidence to get numerical
calculation and solder quantity based on whole mask space and user-defined
conditions.
Solder paste is an adhesive material to connect bare PCB and components. The solder
quantity in reflow soldering process is decided by the size of open metal mask and
metal mask thickness. For solder quantities calculation, metal mask opening size can
be extracted from CAD design, however metal mask thickness should be inputted by
you. In addition, the solder quantity in wave soldering process is decided by the
component pin’s lead size, lead type, including clinching, and other conditions.
Solder quantity calculation in wave soldering process is difficult to get exact
results. This tool provides evidence to get numerical calculation and solder
quantity based on whole mask space and user-defined conditions. Figure 1.
PollEx PCBSolder Quantity Calculator provides two options.
Solder Mask Checker: Solder quantity calculator for wave soldering
process.
Metal Mask Checker: Solder quantity calculator for reflow soldering
process.