Solder Fatigue

Introduction

Solder fatigue analysis is to analyze and predict fatigue damage of the solder joint between a component and the base Printed Circuit Board (PCB).

Methods

  1. Difference in CTE: This method is based on mismatch in local thermal expansion coefficient of PCB and component soldered onto the board.
  2. Syed creep energy density: It is based on creep energy density.
  3. Syed creep strain: It is based on creep strain.
  4. Darv creep energy density: This method uses the concept of crack growth to calculate the life.

Syed creep energy density, Syed creep strain and darv creep energy density method is supported only for nonlinear static analysis without load case.

Note: MPA is the preferred unit for solving solder fatigue problem.