PFATSDR

Bulk Data Entry Defines properties for solder fatigue analysis.

Format

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
PFATSDR ID C4GAMMA K1 K2 K3 K4

Definition

Field Contents SI Unit Example
ID Entry identification number.

Each PFATSDR entry must have a unique ID. This is referenced by the FATDEF Subcase Information Entry.

No default (Integer > 0)

C4GAMMA Empirical model constraint for solder fatigue.

No default (Real > 0)

K1 Constant in crack initiation equation in Darveaux method. 2

No default (Real)

K2 Constant in crack initiation equation in Darveaux method.

No default (Real)

K3 Constant in crack growth equation in Darveaux method. 2

No default (Real)

K4 Constant in crack growth equation in Darveaux method.

No default (Real)

Comments

  1. C4GAMMA is used to calculate the strain range of the solder joint in DIFFCTE method:
    Δγ=CLDhsΔαΔT
    Where,
    LD
    Component length.
    α
    Coefficient of thermal expansion (CTE).
    hs
    Solder joint height.
    Δα=CTEpCTEc
    Difference between thermal expansion coefficients of the PCB and the component soldered onto the board.
    T
    Input temperature.
    ΔT=TpTc
    Difference between temperatures of the PCB and the component soldered onto the board.
    C
    Empirical model constant for solder fatigue (specified using the C4GAMMA field). It is equal to 12 for leadless joint type. For BGA type, you can define the empirical model constant.

    Refer to Solder Fatigue Analysis for additional information.

  2. K1 and K3 are dependent on the modeling of solder joints such as the thickness of solder joint interface layers and the creep constitutive model. Therefore, K1 and K3 are not material constants. Units of dimension for K1 and K3 should be consistent with those of length and stress on FATPARM. Dimension of K1 is cycles/stressK2. The dimension of K3 is (length/cycle)*(1/stressK4). For example, if length units and stress units in FATPARM are mm and MPa respectively, the units of K1 and K3 should be cycles/MPaK2 and (mm/cycle)*(1/MPaK4), respectively.
    The constants are used in the following equations to calculate life (N) of a solder joint:
    • Crack initiation:
      N0=K1ΔWK2ave
    • Crack growth:
      dadN=K3ΔWK4ave
    • Life:
      N=N0+adadN

    Where, α is the joint diameter at the interface defined FATSDR.