FATSDR

Bulk Data Entry Defines the solder joint for consideration in solder fatigue analysis.

Format

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
FATSDR ID SDRTYP SIDPKG SIDPCB
DIM PKGLEN SDRTHK DIAINFC
SOLDER SDR1 SDR2 etc etc etc

Definitions

Field Contents SI Unit Example
ID Entry identification number.

Each FATSDR entry must have a unique ID. The FATDEF Subcase Information Entry may reference this ID.

No default (Integer > 0)
SDRTYP Defines solder joint type. Mandatory when the DIFFCTE method is used.
XLEAD
Leadless solder joint.
BGA
Ball Grid Array solder joint.

No default
SIDPKG Element SET identification number of the component. Mandatory when the DIFFCTE method is used.

No default (Integer > 0)
SIDPCB Element SET identification number of the PCB. Mandatory when the DIFFCTE method is used.

No default (Integer > 0)
DIM Optional continuation line indicating the dimension information follows.
PKGLEN Component length.
Blank (Default)
Real
PKGTHK Solder thickness.
Blank (Default)
Real
DIAINFC Joint diameter at the interface.

Since it is used as a final crack length of solder joint in DARV method, the value is mandatory when DARV method is used.

No default (Real > 0)
SOLDER Continuation line indicating the solder SETs follow.
SDRi Element SET of solder "i."

No default (Integer > 0)

Comments

  1. For SDRTYP=XLEAD, two SDRi are expected. Otherwise, an error is issued during the run.
  2. Fatigue load should be a static load with Thermal Expansion Coefficient when the DIFFCTE method is used.
  3. Load History via the TABFAT entry is not allowed.
  4. If DIM continuation line is not specified, OptiStruct will attempt to measure this from Finite Element Mesh data when the DIFFCTE method is used.